BS EN 60317-35-2014 pdf download.Specifications for particular types of winding wires
Part 35:Solderable polyurethane enamelled round copper wire, class 155, with a bonding layer.
This part of IEC 60317 specifies the requirements of solderable enamelled round copper winding wire of class 155 with a dual coating. The underlying coating is based on polyurethane resin, which may be modified providing it retains the chemical identity of the original resin and meets all specified wire requirements. The superimposed coating is a bonding layer based on a thermoplastic resin.
NOTE A modified resin is a resin that has undergone a cherrncal change, or contains one or mote additives to enhance certain performance or application characteristics.
The range of nominal conductor diameters covered by this standard is:
— Grade 1B: 0,020 mm up to and including 0,800 mm:
— Grade 2B: 0,020 mm up to and including 0,800 mm.
The nominal conductor diameters are specified in Clause 4 of IEC 60317-0-1:2013.
2 Normative references
The following documents, in whole or in part, are normatively referenced in this document and are indispensable for Its application. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies.
IEC 60317-0-1:2013, Specifications for particular types of winding wires — Part 0-1: General requirements — Enamelled round copper wire
3 Terms, definitions, general notes and appearance
3.1 Terms and definitions
Subclause 3.1 of IEC 60317-0-1:2013 applies.
3.2 General notes
3.2.1 Test methods
Subclause 3.2.1 of IEC 60317-0-1:2013 applies. In case of inconsistencies between IEC 60317-0-1:2013 and this part of IEC 60317, the latter shall prevail.
3.2.2 Winding wire
Class 155 is a thermal class that requires a minimum temperature index of 155 and a heat shock temperature of at least 175 °C.
4 Dimensions
Clause 4 of IEC 60317-0-1:2013 applies.
5 Electrical resistance
Clause 5 of IEC 60317-0-1:2013 applies.
6 Elongation
Clause 6 of IEC 60317-0-1:2013 applies.
7 Springiness
Clause 7 of (EC 6031 7-0-1 :2013 applies.
8 Flexibility and adherence
Clause 8 of IEC 60317-0-1:2013 applies.
9 Heat shock
Clause 9 of IEC 60317-0-1:2013 applies. The minimum heat shock temperature shall be 175 DC.
10 Cut-through
No failure shall occur within 2 mm at 200 DC.
11 Resistance to abrasion (nominal conductor diameters from 0,250 mm up to
and including 0.800 mm)
The wire shall meet the requirements given in Table 1.
For intermediate nominal conductor diameters, the value of the next larger nominal conductor diameter shall be taken.
14 Continuity of insulation
Clause 14 of IEC 60317-0-1:2013 applies.
15 Temperature index
Clause 15 of IEC 60317-0-1:2013 applies. The minimum temperature index shall be 155.
16 Resistance to refrigerants
Test inappropriate.
17 Solderability
17.1 Nominal conductor diameters up to and including 0,100 mm
The temperature of the solder bath shall be (390 ± 5) ‘C. The maximum immersion time shall be 2 s.
BS EN 60317-35:2014
6031 7-35 © IEC:2013 — 9 — EN 6031 7-35:2014
The surface of the tinned wire shall be smooth and free from holes and enamel residues.
17.2 Nominal conductor diameters over 0,100 mm
The temperature of the solder bath shall be (390 ± 5) ‘C. The maximum immersion time (in seconds) shall be the following multiple of the nominal conductor diameter (in millimetres) with a minimum of 2 s.
The surface of the tinned wire shall be smooth and free from holes and enamel residues.
18 Heat or solvent bonding
18.1 Heat bonding
18.1.1 Heat bonding strength of a helical coil
18.1.1.1 At room temperature
The specimens shall be prepared according to the test method, and the temperature of the oven for bonding shall be fixed as agreed between purchaser and supplier for the different types of bonding enamels. The suggested temperature for polyamide bonding enamel is (200 ± 2) °C and the suggested temperature for polyvinyl butyral bonding enamel is
(170 ± 2) °C.
Results: when testing the specimens according to the test method, under the action of load specified in Table 2, no turns (other than possibly the first and the last) shall separate.
18.1.1.2 At elevated temperature
The specimens shall be prepared and shall be conditioned as described in the test method.
The elevated temperature shall be fixed as agreed between purchaser and supplier for the different types of bonding enamels. The suggested temperature for polyamide bonding enamel is (155 ± 2) DC and the suggested temperature for polyvinyl butyral bonding enamel is
(90 ± 2) °C.
Results: when testing the specimens according to the test method, under the action of load specified in Table 2, no turns (other than possibly the first and the last) shall separate.BS EN 60317-35-2014 pdf download.