BS EN 60317-38-2014 pdf download.Specifications for particular types of winding wires
Part 38: Polyester or polyesterimide overcoated with polyamide-imide, enamelled round copper wire, class 200, with a bonding layer.
This part of IEC 60317 specifies the requirements of enamelled round copper winding wire of class 200 with a triple coating. The underlying coating is based on polyester or polyesterimide resin, which may be modified providing it retains the chemical identity of the original resin and meets all specified wire requirements. The secondary coating is based on polyamide-imide resin. The third coating is a bonding layer based on a thermoplastic or thermosetting resin.
NOTE A modified resin is a resin that has undergone a chemical change, or contains one oc more additives to
enhance certain performance or application characteristics
The range of nominal conductor diameters covered by this part is:
— Grade 1B: 0,050 mm up to and including 1,600 mm;
— Grade 2B: 0,050mm up to and including 1,600 mm.
The nominal conductor diameters are specified in Clause 4 of IEC 60317-0-1:2013.
2 Normative references
The following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies.
IEC 60317-0-1:2013, Specifications for particular types of winding wires — Part 0-1: General requirements — Enamelled round copper wire
3 Terms, definitions, general notes and appearance
3.1 Terms and definitions
Subclause 3.1 of IEC 60317-0-1:2013 applies.
3.2 General notes
3.2.1 Methods of test
Subclause 3.2.1 of IEC 60317-0-1:2013 applies. In case of inconsistencies between IEC 6031 7-0-1 :2013 and this part of IEC 60317, the latter shall prevail.
3.2.2 Winding wire
Class 200 is a thermal class that requires a minimum temperature index of 200 and a heat shock temperature of at least 220 °C.
4 Dimensions
Clause 4 of IEC 60317-0-1:2013 applies.
5 Electrical resistance
Clause 5 of IEC 60317-0-1:2013 applies.
6 Elongation
Clause 6 of IEC 60317-0-1:2013 applies.
7 Springiness
Clause 7 of IEC 60317-0-1:2013 applies.
8 Flexibility and adherence
Clause 8 of IEC 6031 7-0-1 :2013 applies. For 8.4. the constant K used for the calculation of the number of revolutions for the peel test shall be 110 mm.
9 Heat shock
Clause 9 of IEC 60317-0-1:2013 applies. The minimum heat shock temperature shall be 220 °C.
10 Cut-through
No failure shall occur within 2 mm at 320 °C.
11 ResIstance to abrasion (nominal conductor diameters from 0,250 mm up to
and Including 1,600 mm)
The wire shall meet the requirements given in Table 1.
For intermediate nominal conductor diameters, the value of the next larger nominal conductor diameter shall be taken.
12 Resistance to solvents Test inappropriate.
13 Breakdown voltage
Clause 13 of IEC 60317-0-1:2013 applies. The elevated temperature shall be 200 C.
14 Continuity of insulation
Clause 14 of IEC 60317-0-1:2013 applies.
15 Temperature index
Clause 15 of IEC 60317-0-1:2013 applies. The minimum temperature index shall be 200.
16 Resistance to refrigerants
Test inappropriate.
17 Solderability Test inappropriate.
18 Heat or solvent bonding
18.1 Heat bonding
18.1.1 Heat bonding strength of a helical coil
18.1.1.1 At room temperature
The specimens shall be prepared according to the test method, and the temperature of the
oven for bonding shall be fixed as agreed between purchaser and supplier for the different
types of bonding enamels. The suggested temperature for polyamide bonding enamel Is
(200 ± 2) OC and the suggested temperature for aromatic polyamide bonding enamel is
(230 ± 2) C.
Results: when testing the specimens according to the test method, under the action of load specified in Table 2, no turns (other than possibly the first and the last) shall separate.
18.1.1.2 At elevated temperature
The specimens shall be prepared and shall be conditioned as described in the test method.
The elevated temperature shall be fixed as agreed between purchaser and supplier for the different types of bonding enamels. The suggested temperature for polyamide bonding enamel is (155 ± 2) °C and the suggested temperature for aromatic polyamide bonding enamel is (170±2) °C.
Results: when testing the specimens according to the test method, under the action of load specified in Table 2, no turns (other than possibly the first and the last) shall separate.BS EN 60317-38-2014 pdf download.